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      YAMAHA 3D Hybrid Module Mounter S10
      Date:2020-11-20    Hits:544
      Can achieve 3D MID ※ mounting to achieve universality Expandable to mount 3D MID to enhance substrate response capabilities Flexible component/variety response capability Strong universality and switchability ※ 3D MID: 3D Molded Interconnect Device

      1. Can achieve 3D mixed mounting


      By adopting a newly developed dispensing head that can be interchanged with the mounting head, it is possible to achieve 3D mounting through interactive implementation of solder paste dispensing and component mounting, achieving mixed mounting.




      The testing dispensing station can be disassembled and assembled on the fixed frame of the feeder.






      2. Scalable to 3D MID mounting




      In order to avoid being limited to regular substrate production and enable the equipment to perform solder paste dispensing and component mounting on three-dimensional objects with different heights, angles, and directions such as concave and convex surfaces, inclined surfaces, and curved surfaces, promoting the development of new models.




      In the future, 3D MID production can be implemented for vehicles/medical devices, communication machines, etc. that were previously difficult to handle.






      3. Enhanced substrate corresponding ability






      4. Flexible component/variety corresponding ability






      5. Highly versatile production interchangeability




      The new refueling trolley that can install 45 feeder tracks can be mixed with existing refueling carts for use




      Basic specifications




      S10


      Substrate size (when buffer function is not used) L50 x W30mm~L1330 x W510mm (standard L955)


      (When using inlet or outlet buffering function) L50 x W30mm~L420 x W510mm


      (When using inlet and outlet buffering functions) L50 x W30mm~L330 x W510mm


      Substrate thickness 0.4-4.8mm


      Substrate transfer direction left → right (standard)


      Substrate transfer speed 900mm/sec


      Mounting speed (12 axis mounting head+2 θ) 0.08sec/CHIP (45000CPH)


      Installation accuracy A( μ+ three σ) CHIP ± 0.040mm


      Installation accuracy B( μ+ three σ) IC ± 0.025mm


      Mounting angle ± 180 °


      Z-axis control/ θ Axis control AC servo motor


      The height of components that can be mounted is 30mm ※ 1 (the height of components that are first mounted is within 25mm)


      Mountable components 0201-120 × 90mm BGA, CSP, connectors, and other irregular components (standard 0402 to)


      Component supply form: 8-56mm material belt (F1/F2 feeder), 8-88mm material belt (F3 electric feeder), rod feeder, tray


      Negative pressure inspection and image inspection for components brought back


      Support for multilingual graphics in Japanese, Chinese, Korean, and English


      Base plate positioning clamp type base plate fixing unit, front reference, automatic adjustment of transmission width


      The maximum number of feeders that can be installed is 90 types (converted by 8mm belt), with 45 connections × two


      Substrate conveying height 900 ± 20mm


      Host size, weight L1250 x D1750 x H1420mm, approximately 1200 kg


      SURFACE MOUNT EQUIPMENT HYBRID MOUNTING EQUIPMENT SOLDER PASTE PRINTER YAMAHA DISPENSER AOI SPI 其他檢查裝置 REFLOW CLEANING EQUIPMENT INKJET PRINTER STORAGE SYSTEM PARTS SUPPORT SYSTEMS AND SOFTWARE

      • 廣東嘉德賀電子有限公司
        東莞市嘉廣自動化股份有限公司
        地址:東莞市長安鎮長青南路1號8棟萬科中心2903-2906室
        電話:0769-81583901
        手機:陳小姐13829245934
        郵箱:chenxia@caltek.cn
      • 蘇州市廣嘉賀電子有限公司
        地址:蘇州市吳中區吳中商城5A寫字樓2606B-C室
        電話:0512-68794542
        手機:賴先生18013707168
        郵箱:mingminglai@caltek.cn
      • 深圳市阿拉玎光電自動化有限公司
        地址:東莞市長安鎮新安社區新崗路洪山工業區(原才譽五金)
        手機:劉先生18027081965
        郵箱:sunlinel@arading.cn
      Copyright ? Guangdong CALTEK Electronics Co., Ltd.. All Rights Reserved.粵ICP備11005865號Power by:0769net.com
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